DocumentCode :
817029
Title :
Model-Based Design Analysis and Yield Optimization
Author :
Pfingsten, Tobias ; Herrmann, Daniel J L ; Rasmussen, Carl Edward
Author_Institution :
Max Planck Inst., Tubingen
Volume :
19
Issue :
4
fYear :
2006
Firstpage :
475
Lastpage :
486
Abstract :
Fluctuations are inherent to any fabrication process. Integrated circuits and microelectromechanical systems are particularly affected by these variations, and due to high-quality requirements the effect on the devices´ performance has to be understood quantitatively. In recent years, it has become possible to model the performance of such complex systems on the basis of design specifications, and model-based sensitivity analysis has made its way into industrial engineering. We show how an efficient Bayesian approach, using a Gaussian process prior, can replace the commonly used brute-force Monte Carlo scheme, making it possible to apply the analysis to computationally costly models. We introduce a number of global, statistically justified sensitivity measures for design analysis and optimization. Two models of integrated systems serve us as case studies to introduce the analysis and to assess its convergence properties. We show that the Bayesian Monte Carlo scheme can save costly simulation runs and can ensure a reliable accuracy of the analysis
Keywords :
Gaussian processes; industrial engineering; sensitivity analysis; Bayesian approach; Gaussian process; design analysis; design specifications; fabrication process; industrial engineering; integrated circuits; integrated systems models; microelectromechanical systems; sensitivity analysis; yield optimization; Bayesian methods; Computational modeling; Design optimization; Fabrication; Fluctuations; Industrial engineering; Integrated circuit yield; Microelectromechanical systems; Monte Carlo methods; Sensitivity analysis; Bayesian statistics; Gaussian process; sensitivity analysis; yield optimization;
fLanguage :
English
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
0894-6507
Type :
jour
DOI :
10.1109/TSM.2006.883589
Filename :
4012101
Link To Document :
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