DocumentCode
817493
Title
Hot topics-trends in advanced packaging technology
Author
Balde, John W.
Author_Institution
Interconnection Decision Consulting, Flemington, NJ, USA
Volume
25
Issue
12
fYear
1992
Firstpage
67
Lastpage
68
Abstract
Advanced packaging is shifting to greater use of multichip modules (MCMs) for applications, not just those running on mainframes. It is argued that the reasons are threefold: higher performance, smaller size, and lower cost.<>
Keywords
multichip modules; packaging; advanced packaging technology; multichip modules; Application specific integrated circuits; Costs; Integrated circuit interconnections; Military computing; Multichip modules; Packaging; Silicon; Surface-mount technology; Wiring; Workstations;
fLanguage
English
Journal_Title
Computer
Publisher
ieee
ISSN
0018-9162
Type
jour
DOI
10.1109/2.179119
Filename
179119
Link To Document