Reliable eye-diagram analysis of data links via device macromodels

Author

Stievano, Igor S. ; Maio, Ivan A. ; Canavero, Flavio G. ; Siviero, Claudio

Author_Institution

Dipt. di Elettronica, Politecnico di Torino, Italy

Volume

29

Issue

1

fYear

2006

Firstpage

31

Lastpage

38

Abstract

This paper addresses the impact of device macromodels on the accuracy of signal integrity and performance predictions for critical digital interconnecting systems. It exploits nonlinear parametric models for both single-ended and differential devices, including the effects of power supply fluctuations and receiver bit detection. The analysis demonstrates that the use of well-designed macromodels dramatically speeds up the simulation as well it preserves timing accuracy even for long bit sequences.

Keywords

digital integrated circuits; equivalent circuits; integrated circuit interconnections; integrated circuit modelling; circuit modeling; data links; device macromodels; digital integrated circuits; digital interconnecting systems; electromagnetic compatibility; eye-diagram analysis; nonlinear parametric models; power supply fluctuations; receiver bit detection; signal integrity; system identification; timing accuracy; Bit error rate; Computational modeling; Data analysis; Electromagnetic interference; Fluctuations; Integrated circuit interconnections; Power supplies; Predictive models; Signal design; Timing; Circuit modeling; digital integrated circuits; electromagnetic compatibility; macromodeling; signal integrity; system identification;

fLanguage

English

Journal_Title

Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1521-3323

Type

jour

DOI

10.1109/TADVP.2005.862645

Filename

1589130