DocumentCode :
817986
Title :
Uncooled mini-DIL module for 980-nm pump lasers
Author :
Li, Jin ; Brattain, Michael ; Rice, Audra K. ; Labudovic, Marko ; Young, Joseph R. ; Cook, Mark ; Ye, Fan ; Davis, Monica K. ; Burka, Michael
Author_Institution :
Univ. of Massachusetts, Lowell, MA, USA
Volume :
29
Issue :
1
fYear :
2006
Firstpage :
171
Lastpage :
177
Abstract :
The importance of lower cost while maintaining high performance of erbium-doped fiber amplifiers (EDFAs) is growing with increased bandwidth demand. The uncooled 980-nm miniature dual-inline (Mini-DIL) pump laser is attractive for compact EDFA designs because it offers the advantages of lower cost, smaller footprint, minimal heat generation, and reduced electrical power consumption. In this paper, we report a low-cost uncooled Mini-DIL module designed for 980-nm pump lasers. A three-dimensional finite element analysis model effectively predicts module thermal and stress performance. Experimental results of module power and coupling efficiency stability over assembly processes are presented. A minimum optical output power of 150 mW is achieved in a group of 10 devices across a temperature range of 0°C to 70°C at a drive current of 350 mA with a 1.5-mm raised ridge InGaAs/AlGaAs single quantum well laser chip.
Keywords :
finite element analysis; optical fibre amplifiers; quantum well lasers; thermal management (packaging); 0 to 70 C; 1.55 mm; 150 mW; 350 mA; 3D finite element analysis model; 980 nm; InGaAs-AlGaAs; assembly process; electrical power consumption; erbium-doped fiber amplifiers; heat generation; miniature dual-inline pump laser; quantum well laser chip; semiconductor laser; stress performance; thermal performance; uncooled laser; Costs; Erbium-doped fiber amplifier; Erbium-doped fiber lasers; Laser excitation; Laser modes; Optical design; Power generation; Power lasers; Pump lasers; Thermal stresses; Finite-element method; miniature dual-inline (Mini-DIL); semiconductor laser; uncooled laser;
fLanguage :
English
Journal_Title :
Advanced Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3323
Type :
jour
DOI :
10.1109/TADVP.2005.849565
Filename :
1589144
Link To Document :
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