DocumentCode :
818123
Title :
Characterization and modeling of parasitic emission in deep submicron CMOS
Author :
Vrignon, Bertrand ; Bendhia, Sonia Delmas ; Lamoureux, Enrique ; Sicard, Etienne
Author_Institution :
Central Res. & Dev., STMicroelectronics, Crolles, France
Volume :
47
Issue :
2
fYear :
2005
fDate :
5/1/2005 12:00:00 AM
Firstpage :
382
Lastpage :
387
Abstract :
This paper presents a study of the parasitic emissions of a 0.18-μm CMOS experimental integrated circuit (IC) and an accurate method for modeling the internal current switching to forecast electromagnetic interference (EMI). The effectiveness of emission reduction techniques is quantified through a set of conducted noise measurements. A simple core model is developed, based on the current switching activity. Added to a lumped-element model of the test board and the package, good agreement between simulation and measurements are obtained up to 10 GHz. The simulation methodology may be applied to forecast the impact of low emission design techniques on the EMI of ICs.
Keywords :
CMOS integrated circuits; electromagnetic interference; integrated circuit noise; interference suppression; lumped parameter networks; switching; CMOS experimental integrated circuit; EMI; complementary metal-oxide semiconductor; conducted noise measurements; deep submicron CMOS; electromagnetic interference; emission reduction techniques; internal current switching; lumped-element model; parasitic emission; CMOS integrated circuits; Electromagnetic interference; Electromagnetic modeling; Integrated circuit modeling; Noise measurement; Packaging; Predictive models; Semiconductor device modeling; Switching circuits; Testing; Complementary metal–oxide semiconductor (CMOS) technology; electromagnetic compatability (EMC); electromagnetic interference (EMI) modeling; on-chip sampling;
fLanguage :
English
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9375
Type :
jour
DOI :
10.1109/TEMC.2005.847408
Filename :
1433064
Link To Document :
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