Title :
Microcarrier for LSI chip used in the HITAC M-880 processor group
Author :
Inoue, Takashi ; Matsuyama, Haruhiko ; Matsuzaki, Eiji ; Narizuka, Yasunori ; Ishino, Masakazu ; Takenaka, Takaji ; Tanaka, Minoru
Author_Institution :
Production Eng. Res. Lab., Hitachi Ltd., Yokohama, Japan
fDate :
2/1/1992 12:00:00 AM
Abstract :
The compact chip carrier named MCC has been developed for high density chip level packaging. The MCC realizes the smallest possible hermetic chip package by introducing full surface flip-chip interconnections, thin-film process technology, built-in termination resistors, and a thermal expansion matched ceramic substrate. The structure of the MCC and the thin-film process technology for its fabrication are reported
Keywords :
ceramics; large scale integration; packaging; substrates; thermal expansion; HITAC M-880 processor group; LSI chip; MCC; built-in termination resistors; compact chip carrier; fabrication; flip-chip bonding; full surface flip-chip interconnections; hermetic chip package; high density chip level packaging; microcarrier; mullite ceramic substrate; smallest possible package; structure; thermal expansion matched ceramic substrate; thermal expansion matching; thin-film process technology; Bonding; Ceramics; Fabrication; Integrated circuit interconnections; Large scale integration; Packaging; Resistors; Substrates; Thermal expansion; Thin film circuits;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
