A feasibility study for the fabrication of planar silicon multichip modules using electron beam lithography for precise location and interconnection of chips

Author

Hopper, Andy ; Jones, Alan ; Augur, Roderick Alan ; Fice, Martyn J. ; Blythe, Simon ; Ahmed, Haaron

Author_Institution

Olivetti Res. Ltd., Cambridge, UK

Volume

15

Issue

1

fYear

1992

fDate

2/1/1992 12:00:00 AM

Firstpage

97

Lastpage

102

Abstract

A technique for fabricating multichip modules (MCMs) by mounting chips in holes etched into silicon motherboards is described. With this approach the front faces of the chips are coplanar with the front of the motherboard, and, hence, the connections between the chips and the motherboards may be made by standard thin-film processes. A method for fabricating such modules using electron beam lithography to locate the chips and to define the interconnections between the chips and the motherboard is discussed. The feasibility of the processes is demonstrated with measurements on a module designed and fabricated to test the stability of the processes

Keywords

electron beam lithography; hybrid integrated circuits; packaging; silicon; thin films; Si MCM; Si mother boards; chips in holes; coplanar front faces; electron beam lithography; feasibility study; interconnection of chips; planar multichip modules; precise location; standard thin-film processes; Electron beams; Etching; Fabrication; Lithography; Multichip modules; Semiconductor device measurement; Silicon; Stability; Testing; Transistors;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.124197

Filename

124197