IR microscopic observation of plastic coated TAB inner lead bonds degrading during thermal cycling

Author

Alpern, Peter ; Tilgner, Rainer

Author_Institution

Siemens AG, Muechen, Germany

Volume

Issue

fYear

1992

fDate

2/1/1992 12:00:00 AM

Firstpage

114

Lastpage

117

Abstract

Infrared (IR) microscopy investigations of tape automated bonding (TAB) contacted chips are described. The ability of the method to detect mechanical stress fields in silicon as induced by a bump or a load is demonstrated. In the case of plastic-coated TAB devices the degradation of the chip after thermal cycling is observed a long time before it may be registered electrically

Keywords

VLSI; environmental testing; failure analysis; life testing; optical microscopy; packaging; reliability; silicon; stress measurement; tape automated bonding; IR microscopic observation; Si stress; chip degradation; coated TAB inner lead bonds; mechanical stress fields detection; plastic-coated TAB devices; tape automated bonding; thermal cycling; Bonding; Coatings; Lead; Mechanical factors; Microscopy; Plastics; Silicon; Temperature; Thermal degradation; Thermal stresses;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.124200

Filename

124200

Link To Document

https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=818302