Title :
IR microscopic observation of plastic coated TAB inner lead bonds degrading during thermal cycling
Author :
Alpern, Peter ; Tilgner, Rainer
Author_Institution :
Siemens AG, Muechen, Germany
fDate :
2/1/1992 12:00:00 AM
Abstract :
Infrared (IR) microscopy investigations of tape automated bonding (TAB) contacted chips are described. The ability of the method to detect mechanical stress fields in silicon as induced by a bump or a load is demonstrated. In the case of plastic-coated TAB devices the degradation of the chip after thermal cycling is observed a long time before it may be registered electrically
Keywords :
VLSI; environmental testing; failure analysis; life testing; optical microscopy; packaging; reliability; silicon; stress measurement; tape automated bonding; IR microscopic observation; Si stress; chip degradation; coated TAB inner lead bonds; mechanical stress fields detection; plastic-coated TAB devices; tape automated bonding; thermal cycling; Bonding; Coatings; Lead; Mechanical factors; Microscopy; Plastics; Silicon; Temperature; Thermal degradation; Thermal stresses;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
