Title :
Conducting metallic oxide contacts on superconducting YBa2 Cu3O7-x thin films
Author :
Jia, Quan-Xi ; Anderson, Wayne A.
Author_Institution :
Dept. of Electr. & Comput. Eng., State Univ. of New York, Amherst, NY, USA
fDate :
2/1/1992 12:00:00 AM
Abstract :
Low resistance contacts to superconducting YBa2Cu3 O7-x (YBCO) thin films have been prepared by using conducting metallic ruthenium oxide, RuO2, as contact electrodes. The surface specific contact resistivity of the best contacts made by DC magnetron sputtering of RuO2 and a structure of Au/RuO2 or Ag/RuO2 on YBCO thin films has an upper limit value in the range of 5×10-8 Ω-cm2 but less than 5×10-6 Ω-cm 2 at 77 K for a single layer RuO2 on YBCO thin films. Auger depth profiling shows diffusion of Y, Ba, and Cu into RuO 2 but no apparent diffusion of Ru into YBCO thin films after thermal treatment of the contact at 500°C. No degradation of zero resistance temperature was seen for the superconducting thin films after the formation of the low resistance contacts. No special pretreatment of the YBCO film surface was required prior to depositing the contact electrodes, but a post-deposition anneal was necessary to obtain a good contact
Keywords :
annealing; barium compounds; contact resistance; high-temperature superconductors; ohmic contacts; ruthenium compounds; superconducting junction devices; superconducting thin films; superconducting transition temperature; yttrium compounds; 500 C; Auger depth profiling; DC magnetron sputtering; YBa2Cu3O7-x thin films; YBa2Cu3O7-x-RuO2; YBa2Cu3O7-x-RuO2-Ag; YBa2Cu3O7-x-RuO2-Au; contact electrodes; diffusion; high temperature superconductors; low resistance contacts; post-deposition anneal; surface specific contact resistivity; thermal treatment; zero resistance temperature; Conductivity; Contact resistance; Electrodes; Gold; Sputtering; Superconducting magnets; Superconducting thin films; Surface resistance; Thermal degradation; Yttrium barium copper oxide;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on