• DocumentCode
    818690
  • Title

    A comparison of gamma and proton radiation effects in 200 GHz SiGe HBTs

  • Author

    Sutton, Akil K. ; Haugerud, Becca M. ; Prakash, A. P Gnana ; Jun, Bongim ; Cressler, John D. ; Marshall, Cheryl J. ; Marshall, Paul W. ; Ladbury, Ray ; Guarin, Fernando ; Joseph, Alvin J.

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • Volume
    52
  • Issue
    6
  • fYear
    2005
  • Firstpage
    2358
  • Lastpage
    2365
  • Abstract
    We present the results of gamma irradiation on third-generation, 200 GHz SiGe HBTs. Pre- and post-radiation dc figures-of-merit are used to quantify the tolerance of the raised extrinsic base structure to Co-60 gamma rays for varying device geometries. Additionally, the impact of technology scaling on the observed radiation response is addressed through comparisons to second generation, 120 GHz SiGe HBTs. Comparisons to previous proton-induced degradation results in these 200 GHz SiGe HBTs are also made, and indicate that the STI isolation oxide of the device shows increased degradation following Co-60 irradiation. The EB spacer oxide, on the other hand, demonstrates increased susceptibility to proton damage. Low dose rate proton testing was also performed and indicate that although there is a proton dose rate effect present in these devices, it cannot fully explain the observed trends. Similar trends have previously been observed for buried oxides and isolation oxides in several MOS technologies and have been attributed to increased charge yield in these oxides for 1.2 MeV Co-60 gamma rays when compared to 63 MeV protons.
  • Keywords
    Ge-Si alloys; MIS devices; buried layers; dosimetry; gamma-ray effects; heterojunction bipolar transistors; isolation technology; proton effects; semiconductor heterojunctions; 120 GHz; 200 GHz; 63 MeV; Co-60 gamma rays; Co-60 irradiation; EB spacer oxide; MOS technologies; STI isolation oxide; SiGe HBTs; buried oxides; extrinsic base structure; gamma radiation effects; isolation oxides; post-radiation dc figures-of-merit; pre-radiation dc figures-of-merit; proton damage; proton dose rate effect; proton radiation effects; proton-induced degradation; shallow trench isolation; Degradation; Gamma rays; Germanium silicon alloys; Heterojunction bipolar transistors; III-V semiconductor materials; Isolation technology; Microelectronics; Proton radiation effects; Silicon germanium; Space technology; EB spacer; ELDRS; SiGe; SiGe HBT; gamma radiation; proton radiation; radiation sources; shallow trench isolation; technology scaling;
  • fLanguage
    English
  • Journal_Title
    Nuclear Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9499
  • Type

    jour

  • DOI
    10.1109/TNS.2005.860728
  • Filename
    1589208