Title :
A Time-Domain Approach for Extracting Broadband Macro-
Models of Differential Via Holes
Author :
Wang, Chen-Chao ; Kuo, Chih-Wen ; Kuo, Chun-Chih ; Wu, Tzong-Lin
Author_Institution :
Dept. of Electr. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung
Abstract :
A novel time-domain approach is proposed to synthesize the broadband macro-pi model of the differential vias based on time-domain reflected/transmitted waveforms either measured by time-domain reflectometry (TDR) or simulated by finite-difference time-domain (FDTD) method. The step responses of the differential via are solved in terms of rational functions by the generalized pencil-of-matrix (GPOM) method. The macro-pi model in terms of the rational functions pairs is obtained through an ABCD matrix transformation. The order of the macro-pi model can be reduced without losing the accuracy according to a residue criterion. The equivalent lumped circuits of the macro-pi model is synthesized by a lumped circuit extraction method (LCEM). The stability and passivity of the extracted models can be preserved based on this time-domain approach and the macro-pi topology. Two examples, one is an asymmentric via and the other is an differential via in four-layer PCB, are used to demonstrate the broadband accuracy of the proposed approach both in time-domain and frequency-domain
Keywords :
SPICE; equivalent circuits; finite difference time-domain analysis; printed circuit design; rational functions; time-domain reflectometry; time-domain synthesis; ABCD matrix transformation; SPICE model; differential via; equivalent lumped circuits; finite-difference time-domain; generalized pencil-of-matrix; lumped circuit extraction; printed circuit boards; signal integrity; time-domain reflectometry; Circuit simulation; Circuit synthesis; Electromagnetic interference; Equivalent circuits; Finite difference methods; Frequency; Packaging; Reflectometry; Time domain analysis; Transmission line matrix methods; Differential via; SPICE model; finite-difference time-domain (FDTD); generalized pencil-of-matrix (GPOM); high-speed interconnects; signal integrity; time-domain reflectometry (TDR);
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/TADVP.2006.879422