• DocumentCode
    819915
  • Title

    Exploiting Hysteresys in MCML Circuits

  • Author

    Alioto, Massimo ; Pancioni, Luca ; Rocchi, S. ; Vignoli, V.

  • Author_Institution
    Dipt. di Ingegneria dell´´Informazione, Siena Univ.
  • Volume
    53
  • Issue
    11
  • fYear
    2006
  • Firstpage
    1170
  • Lastpage
    1174
  • Abstract
    In this brief, hysteresis is introduced to improve the noise margin of positive-feedback source-coupled logic (PFSCL) gates, that are a modification of MOS current-mode logic recently proposed by the same authors. To better understand the effect of hysteresis on the performance and the design of these circuits, a simple analytical model of the noise margin is developed. Extensive simulations on a 0.18-mum CMOS process confirm the adequate accuracy of the model. The noise margin improvement due to the hysteresis is then exploited to reduce the logic swing, which can be beneficial in terms of the speed performance or the power consumption. Practical cases where hysteresis is advantageous are identified, and a comparison with PFSCL gates without hysteresis is carried out. Simulations confirm that, in some well-defined cases, hysteresis can significantly reduce the gate delay under a power constraint, or achieve a power saving under a speed constraint. As a fundamental result, hysteresis turns out to be an interesting design option to improve the power efficiency of PFSCL gates
  • Keywords
    CMOS logic circuits; current-mode logic; hysteresis; logic design; logic gates; 0.18 micron; CMOS process; MCML circuit hysteresis; MOS current-mode logic; positive-feedback source-coupled logic gates; Analytical models; CMOS logic circuits; CMOS process; Circuit noise; Circuit simulation; Energy consumption; Hysteresis; Logic gates; Noise reduction; Semiconductor device modeling; CMOS; MOS current-mode logic (MCML); hysteresis; modeling; source-coupled logic (SCL);
  • fLanguage
    English
  • Journal_Title
    Circuits and Systems II: Express Briefs, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1549-7747
  • Type

    jour

  • DOI
    10.1109/TCSII.2006.882845
  • Filename
    4012366