Microwave probe for circuit/device testing

Author

Rodriguez-Tellez, J.

Author_Institution

Dept. of Electr. Eng., Bradford Univ., UK

Volume

139

Issue

3

fYear

1992

fDate

6/1/1992 12:00:00 AM

Firstpage

333

Lastpage

338

Abstract

A probe for the high frequency measurement of discrete semiconductor devices in a naked form is described. Because conventional coplanar based probes cannot measure such devices directly, an artificial package usually needs to be fabricated to enable the device to be probed via the artificial package pads. The new probe avoids this need and overcomes the severe problems normally encountered in de-embedding the packaging effects from the device data. The design of the probe and its RF performance are described with the use of GaAs terminations. The usefulness of the probe in assessing packaging effects in microwave bipolar devices is demonstrated by measuring the S-parameters of a bipolar device in a naked and packaged environment

Keywords

MMIC; S-parameters; integrated circuit testing; microwave devices; microwave integrated circuits; microwave measurement; probes; semiconductor device testing; solid-state microwave devices; GaAs terminations; IC testing; MIC; MMIC; S-parameters; device testing; discrete semiconductor devices; high frequency measurement; microwave bipolar devices; microwave probe; packaging effects;

fLanguage

English

Journal_Title

Circuits, Devices and Systems, IEE Proceedings G

Publisher

iet

ISSN

0956-3768

Type

jour

Filename

143330