DocumentCode
822108
Title
Threshold voltage instabilities in high-κ gate dielectric stacks
Author
Zafar, Sufi ; Kumar, Arvind ; Gusev, Evgeni ; Cartier, E.
Author_Institution
Res. Div., IBM T. J. Watson Res. Center, Yorktown Heights, NY, USA
Volume
5
Issue
1
fYear
2005
fDate
3/1/2005 12:00:00 AM
Firstpage
45
Lastpage
64
Abstract
Over recent years, there has been increasing research and development efforts to replace SiO2 with high dielectric constant (high-κ) materials such as HfO2, HfSiO, and Al2O3. An important transistor reliability issue is the threshold voltage stability under prolonged stressing. In these materials, threshold voltage is observed to shift with stressing time and conditions, thereby giving rise to threshold voltage instabilities. In this paper, we review various causes of threshold voltage instability: charge trapping under positive bias stressing, positive charge creation under negative bias stressing (NBTI), hot-carrier stressing, de-trapping and transient charge trapping effects in high-κ gate dielectric stacks. Experimental and modeling studies for these threshold voltage instabilities are reviewed.
Keywords
dielectric materials; dielectric properties; hot carriers; reliability; transistors; Al2O3; HfO2; HfSiO; high-k gate dielectric stacks; hot-carrier stressing; negative bias stressing; positive bias stressing; positive charge creation; threshold voltage instability; threshold voltage reliability; transient charge trapping; transistor reliability issue; Dielectric materials; Hafnium oxide; High-K gate dielectrics; Hot carrier effects; Hot carriers; Niobium compounds; Research and development; Stability; Threshold voltage; Titanium compounds; Charge trapping; NBTI; high k; hot carriers; threshold voltage reliability;
fLanguage
English
Journal_Title
Device and Materials Reliability, IEEE Transactions on
Publisher
ieee
ISSN
1530-4388
Type
jour
DOI
10.1109/TDMR.2005.845880
Filename
1435388
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