• DocumentCode
    822239
  • Title

    Reliability improvement of rapid thermal oxide using gas switching

  • Author

    Lee, Min Hung ; Yu, Cheng-Ya ; Yuan, Fon ; Chen, K.-F. ; Lai, Chang-Chi ; Liu, Chee Wee

  • Author_Institution
    Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
  • Volume
    16
  • Issue
    4
  • fYear
    2003
  • Firstpage
    656
  • Lastpage
    659
  • Abstract
    The instantaneous switch-off of the gas precursors during the ramp-down cycle in a spike ramp process is demonstrated to be an effective method to enhance the reliability of rapid thermal oxide. Due to the slow ramp-down rate (60°C-90°C/s) of a rapid thermal process, the oxidation during the slow ramp-down cycle may produce the inferior oxide, especially for ultrathin oxide. To avoid the oxidation in the slow ramp-down cycle, the oxidation precursor (oxygen) is switched off during the ramp-down cycle. The reliability of resulting oxide without oxidation during the ramp-down cycle is enhanced as compared with the conventional oxide, which is still oxidized during the ramp-down cycle.
  • Keywords
    MIS devices; oxidation; rapid thermal processing; semiconductor device reliability; semiconductor diodes; 250 mbar; NMOS diode; Si-SiO2; gas switching; instantaneous gas precursor switch-off; interface quality; interface state density; oxidation time control; ramp-down cycle; rapid thermal oxidation; rapid thermal processor; reliability; spike ramp process; ultrathin oxide; Cooling; Helium; Interface states; Lamps; MOS devices; Oxidation; Rapid thermal processing; Switches; Thermal stresses; Weight control;
  • fLanguage
    English
  • Journal_Title
    Semiconductor Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0894-6507
  • Type

    jour

  • DOI
    10.1109/TSM.2003.818982
  • Filename
    1243979