DocumentCode :
823151
Title :
Enhancing circuit design flexibility with argon implanted polysilicon resistor
Author :
Lin, C.S. ; Fang, Y.K. ; Chen, S.F. ; Lin, C.Y. ; Hsieh, M.C. ; Hsu, Y.L. ; Hsu, S.-L.
Author_Institution :
Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
Volume :
39
Issue :
19
fYear :
2003
Firstpage :
1409
Lastpage :
1411
Abstract :
An argon implanted polysilicon thin-film resistor is proposed to raise the sheet resistance and preserve the original electrical characteristics of a resistor for high voltage CMOS technology applications. The experiment results indicate the resistance can be raised by almost two times in magnitude while the voltage coefficient of resistance (VCR) and temperature coefficient of resistance (TCR) are shifted by only 7% and 11% at maximum, respectively. The technology offers potential applications for enhancing flexible circuit design in high voltage CMOS technology.
Keywords :
CMOS integrated circuits; argon; electric resistance; elemental semiconductors; integrated circuit design; ion implantation; power integrated circuits; silicon; thin film resistors; Ar implanted polysilicon resistor; HV CMOS technology applications; Si:Ar; TCR; VCR; circuit design flexibility enhancement; high voltage CMOS; polysilicon thin-film resistor; sheet resistance; temperature coefficient of resistance; voltage coefficient of resistance;
fLanguage :
English
Journal_Title :
Electronics Letters
Publisher :
iet
ISSN :
0013-5194
Type :
jour
DOI :
10.1049/el:20030883
Filename :
1244173
Link To Document :
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