Title :
THz Thermal Emission Control Via Electromagnetic Band Engineering
Author :
Zimmerman, Ian A. ; Ziran Wu ; Hao Xin ; Ziolkowski, Richard W.
Author_Institution :
Dept. of Phys., Univ. of Arizona, Tucson, AZ, USA
Abstract :
In the following, we report on the design and implementation of an inexpensive thermal source for THz radiation with a highly tunable radiation signature. It consists of five 350- μm-thick Si wafers, each spaced 1 mm apart. The thermal emission of this structure was calculated analytically and numerically. A comprehensive study was performed that included analyzing the oblique incidence, polarization, and design tolerance effects. The thermal emission was calculated using both Kirchhoff´s law and directly using a Green´s function method. It was measured using a Michelson interferometer. The predicted and measured thermal emission spectra had peaks around 150 GHz apart, with a narrow bandwidth of 50 GHz. The peaks were up to 80% of the expected blackbody levels and the bandgaps had emission levels of about 20% of those blackbody values. We demonstrate that, using these techniques, it is possible to achieve a desired THz thermal emission signature, with narrowband features that can be engineered to have specific angles of emission and polarization states.
Keywords :
Green´s function methods; blackbody radiation; photonic band gap; terahertz metamaterials; terahertz wave generation; Green´s function method; Kirchhoff law; Michelson interferometer; Si; THz radiation; THz thermal emission control; bandwidth 50 GHz; design tolerance effects; electromagnetic band engineering; highly tunable radiation signature; inexpensive thermal source; measured thermal emission spectra; metamaterials; oblique incidence; polarization; silicon wafers; size 350 mum; Conductivity; Green´s function methods; Metamaterials; Parametric study; Periodic structures; Silicon; Thermal engineering; Blackbody radiation; THz thermal emission; electromagnetic bandgap (EBG) structures;
Journal_Title :
Terahertz Science and Technology, IEEE Transactions on
DOI :
10.1109/TTHZ.2013.2296995