Title :
Static analysis of the die picking process
Author :
Lin, Yeong-Jyh ; Hwang, Sheng-Jye
Author_Institution :
Dept. of Mech. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
fDate :
4/1/2005 12:00:00 AM
Abstract :
A numerical procedure was applied to simulate the pickup process for a die bonder to study the breakage of GaAs dice. Parameters such as needle ejecting speed, vacuum pressure, and radius of needle were investigated by the Taguchi method to obtain the manufacture process working-window in order to shorten the tuning time. It was found that the ejecting speed of the needle and the downward pressing force of the pickup collet are the major factors for die breakage. This procedure could also be applied to inspecting the effects of other factors or analyzing different types of pickup machines.
Keywords :
III-V semiconductors; Taguchi methods; gallium arsenide; integrated circuit bonding; microassembling; GaAs; Taguchi method; die bonder; die breakage; die picking process; finite-element method; manufacture process working-window; needle ejecting speed; pickup collet; pickup machines; pickup process; static analysis; vacuum pressure; Bonding; Finite element methods; Gallium arsenide; MMICs; Manufacturing processes; Microassembly; Needles; Pressing; Production; Surface cracks; Die bonder; Taguchi method; finite-element method; pickup process;
Journal_Title :
Electronics Packaging Manufacturing, IEEE Transactions on
DOI :
10.1109/TEPM.2005.847396
