DocumentCode
823774
Title
Recipe optimization and design software development of tape carrier package (TCP) inner lead bonding (ILB)
Author
Ni, Ching-Yu ; Yoon, Ki-Sang ; Ahn, Hyo-Jung ; Chen, Ching-I
Author_Institution
Taiwan Semicond. Manuf. Co. Ltd., Hsinchu, Taiwan
Volume
28
Issue
2
fYear
2005
fDate
4/1/2005 12:00:00 AM
Firstpage
150
Lastpage
157
Abstract
This paper proposes an optimization methodology for quickly determining a bonding recipe for the inner lead bonding (ILB) of a tape carrier package (TCP). The recipe consists of the bonding force, stage temperature, bonding time, and geometrical forming. The bonding force derivation was based on the essential relationship between the bonding force and sinking value from the referred literature. The remaining three parameter equations were derived using empirical accumulation. The experimental data were collected by conducting eight TCP product trial runs to validate the methodology. In addition, the user-interface software was programmed to be user friendly. The development cycle time can be condensed from the average number of hours to less than one hour, revealing a time saving improvement during practical applications. Good yield rates were obtained as well.
Keywords
circuit optimisation; integrated circuit packaging; lead bonding; user interfaces; bonding force; bonding recipe; bonding time; geometrical forming; inner lead bonding; parameter equations; sinking value; stage temperature; tape carrier package; user-interface software; Application software; Bonding forces; Design optimization; Equations; Optimization methods; Packaging; Programming; Software design; Software packages; Temperature; Bonding recipe; inner lead bonding (ILB); tape carrier package (TCP);
fLanguage
English
Journal_Title
Electronics Packaging Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
1521-334X
Type
jour
DOI
10.1109/TEPM.2005.848472
Filename
1435553
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