• DocumentCode
    824049
  • Title

    Time-domain electromagnetic analysis of interconnects in a computer chip package

  • Author

    Becker, Wiren D. ; Harms, Paul H. ; Mittra, Raj

  • Author_Institution
    Electromagn. Commun. Lab., Illinois Univ., Urbana, IL, USA
  • Volume
    40
  • Issue
    12
  • fYear
    1992
  • fDate
    12/1/1992 12:00:00 AM
  • Firstpage
    2155
  • Lastpage
    2163
  • Abstract
    The determination of an equivalent circuit to approximate the behavior of an interconnect in a computer package is addressed. Equivalent circuits allow the analysis of a complete interconnect path in a circuit simulator where a full-wave analysis tool would require more memory or computer time than in currently available. Two important components of an interconnect in a computer package are uniform transmission lines, such as a microstrip line or a stripline, and discontinuities in the interconnects, such as a via between two transmission lines. A methodology for deriving a frequency-dependent description of coupled transmission lines and an equivalent circuit of a via using time-domain full-wave solutions of Maxwell´s equations is presented
  • Keywords
    equivalent circuits; microstrip components; packaging; strip line components; time-domain analysis; Maxwell´s equations; circuit simulator; computer chip package; coupled transmission lines; discontinuities; electromagnetic analysis; equivalent circuit; frequency-dependent description; interconnects; microstrip line; stripline; time-domain full-wave solutions; uniform transmission lines; via; Analytical models; Circuit analysis; Circuit simulation; Computational modeling; Distributed parameter circuits; Electromagnetic analysis; Equivalent circuits; Integrated circuit interconnections; Packaging; Time domain analysis;
  • fLanguage
    English
  • Journal_Title
    Microwave Theory and Techniques, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9480
  • Type

    jour

  • DOI
    10.1109/22.179876
  • Filename
    179876