• DocumentCode
    825153
  • Title

    Prediction and Measurement of Radiation Damage to CMOS Devices on Board Spacecraft

  • Author

    Cliff, R.A. ; Danchenko, V. ; Stassinopoulos, E.G. ; Sing, M. ; Brucker, G.J. ; Ohanian, R.S.

  • Author_Institution
    Goddard Space Flight Center Greenbelt, Maryland
  • Volume
    23
  • Issue
    6
  • fYear
    1976
  • Firstpage
    1781
  • Lastpage
    1788
  • Abstract
    The CMOS Radiation Effects Measurement (CREM) experiment is presently being flown on the Explorer-55. The purpose of the experiment is to evaluate device performance in the actual space radiation environment and to correlate the respective measurements to on-the-ground laboratory irradiation results. The experiment contains an assembly of CMOS and P-MOS devices shielded in front over 2¿ steradian by flat slabs of aluminum of 40, 80, 150, and 300 mils (1.02, 2.04, 3.81, and 7.62mm) thicknesses, and by a practically infinite shield in the back. This paper presents initial results obtained from the CREM experiment. Predictions of radiation damage to C-MOS devices are based on standard environment models and computational techniques. A comparison of the shifts in CMOS threshold potentials, that is, those measured in space to those obtained from the on-the-ground simulation experiment with Co-60, indicates that the measured space damage is smaller than predicted by about a factor of 2-3 for thin shields (t < 100 mils), but agrees well with predictions for thicker shields. It is not clear at this time how the trapped particle environment models or the computational methods should be modified in order to achieve better agreement between experimental results and predicted damage curves. A subsequent paper will present some considerations along these lines as well as an evaluation of performance of C-MOS devices located in a typical electronic subsystem box within the spacecraft.
  • Keywords
    Aluminum; Assembly; Computational modeling; Extraterrestrial measurements; Predictive models; Radiation effects; Semiconductor device modeling; Slabs; Space vehicles; Thickness measurement;
  • fLanguage
    English
  • Journal_Title
    Nuclear Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9499
  • Type

    jour

  • DOI
    10.1109/TNS.1976.4328578
  • Filename
    4328578