Title :
High density pin board matrix switches for automated MDF systems
Author :
Kanai, Tsuneo ; Umemura, Shigeru ; Inagaki, Shuichiro ; Hosokawa, Shigefumi
Author_Institution :
NTT Corp., Tokyo, Japan
fDate :
10/1/1992 12:00:00 AM
Abstract :
High-density, low-cost pin board matrix switches for automated main distributing frame (MDF) systems are described. The MDF system has two basic functions, cross connection and route setting for line test functions. These two functions can be performed automatically using a robot hand to insert a connecting pin into a crosspoint hole on the matrix board. Each crosspoint hole has four isolated cylindrical contacts that are connected to XA, YA , XB, and YB conductive patterns, which represent the A and B wires of a telephone set circuit. Corresponding to the four contacts of a crosspoint hole, a connecting pin has two spring contacts, one spring contact to connect X A and YA conductive patterns, and the other for connecting XB and YB conductive patterns. In addition, arrangements have been made to perform the route setting for line testing. A matrix board with crosspoint holes on a 1.5-mm grid has been attained using the low-contact-force design and minimum insulation spacing between the neighboring conductive patterns. The design also considers requirements for the robot hand interface. These pin board matrix switches allow the MDF system to be automated
Keywords :
switching systems; telephone exchanges; 1.5 mm; automated MDF systems; automated main distributing frame; connecting pin insertion; cross connection; crosspoint holes; crosspoint switches; four contact holes; high density matrix switches; low-contact-force design; matrix board; minimum insulation spacing; pin board matrix switches; robot hand interface; route setting for line test functions; spring contacts; telephone set circuit; Circuits; Insulation; Joining processes; Performance evaluation; Robotics and automation; Springs; Switches; System testing; Telephony; Wires;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on