DocumentCode :
826025
Title :
High-Value Design Techniques for Mitigating Random Defect Sensitivities
Author :
Maynard, Daniel N. ; Rosner, Raymond J. ; Hibbeler, Jason D. ; Culp, James A. ; Barnett, Thomas S.
Author_Institution :
IBM Syst. & Technol. Group, Burlington, VT
Volume :
21
Issue :
3
fYear :
2008
Firstpage :
329
Lastpage :
336
Abstract :
Today´s sophisticated design-for-manufacturability (DFM) methodologies provide a designer with an overwhelming amount of choices, many with significant costs and unclear value. The technology challenges of subwavelength lithography, new materials, device types/sizes, etc., can mask the underlying random defect yield contribution which ultimately dominates mature manufacturing, and the distinction between technology limitations and process excursions must also be understood. The best DFM strategy fully exploits all of the available techniques that mitigate a design´s sensitivity to random defects where the value is clearly quantifiable, yet few designers seize this opportunity. This paper provides a roadmap through the entire design flow and gives an overview of the various options.
Keywords :
design for manufacture; lithography; design flow; design-for-manufacturability; high-value design techniques; random defect sensitivities; random defect yield contribution; subwavelength lithogrpahy; Automation; Costs; Design for manufacture; Design methodology; Electronics industry; Lithography; Manufacturing processes; Redundancy; Semiconductor device manufacture; Semiconductor device modeling; Design automation; very-large-scale integration; yield estimation; yield optimization;
fLanguage :
English
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
0894-6507
Type :
jour
DOI :
10.1109/TSM.2008.2001206
Filename :
4589039
Link To Document :
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