• DocumentCode
    827391
  • Title

    Development of Integrated Thermionic Circuits for High-Temperature Applications

  • Author

    Cormick, J.Byron Mc ; Wilde, Dale K. ; Depp, Steven W. ; Hamilton, Douglas J. ; Kerwin, William J.

  • Author_Institution
    Los Alamos National Laboratory, Los Alamos, NM 87545.
  • Issue
    2
  • fYear
    1982
  • fDate
    5/1/1982 12:00:00 AM
  • Firstpage
    140
  • Lastpage
    144
  • Abstract
    This paper describes a class of microminiature, thin-film devices known as integrated thermionic circuits (ITC) capable of extended operation in ambient temperatures up to 500°C. The evolution of the ITC concept is discussed. A set of practical design and performance equations is demonstrated. Recent experimental results are discussed in which both devices and simple circuits have successfully operated in 500°C environments for extended periods of time (greater than 11000 h).
  • Keywords
    Anodes; Bonding; Cathodes; Equations; Integrated circuit technology; Substrates; Temperature; Thermionic emission; Thin film circuits; Thin film devices;
  • fLanguage
    English
  • Journal_Title
    Industrial Electronics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0278-0046
  • Type

    jour

  • DOI
    10.1109/TIE.1982.356651
  • Filename
    4180380