• DocumentCode
    828504
  • Title

    Comments on "Modeling of Metallic Carbon-Nanotube Interconnects for Circuit Simulations and a Comparison With Cu Interconnects for Sealed Technologies

  • Author

    Li, Hong ; Yin, Wen-Yan ; Mao, Jun-Fa

  • Author_Institution
    Center for Microwave & RF Technol., Shanghai Jiao Tong Univ.
  • Volume
    25
  • Issue
    12
  • fYear
    2006
  • Firstpage
    3042
  • Lastpage
    3044
  • Abstract
    For original paper, see Raychowdhury and Roy, IEEE Trans. Comput.-Aided Design Integr. Circuits Syst., vol.25, no.1, p.58-65, 2006 January
  • Keywords
    carbon nanotubes; circuit simulation; copper; electric resistance; integrated circuit interconnections; nanotube devices; Cu; circuit simulations; compact resistance; differential resistance; metallic carbon-nanotube interconnects; Capacitance; Carbon nanotubes; Circuit simulation; Inductance; Integrated circuit interconnections; Integrated circuit technology; Microwave technology; Radio frequency; Radiofrequency identification; Voltage;
  • fLanguage
    English
  • Journal_Title
    Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0278-0070
  • Type

    jour

  • DOI
    10.1109/TCAD.2006.883920
  • Filename
    4014539
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=828504