DocumentCode :
829365
Title :
Thin film transistor integration on glass and plastic substrates in amorphous silicon technology
Author :
Nathan, A. ; Servati, P. ; Karim, K.S. ; Striakhilev, D. ; Sazonov, A.
Volume :
150
Issue :
4
fYear :
2003
Abstract :
The authors review amorphous silicon (a-Si:H) thin film transistor (TFT) integration and design considerations, including stability, and present examples of integration for two application areas: active matrix organic light emitting diode (AMOLED) displays and active matrix flat panel imagers (AMFPIs) for medical imaging. Pixel architectures and TFT circuit topologies are described that are amenable for vertically integrated, high aperture ratio or high fill factor pixels. Here, the OLED or detector layers are integrated directly above the TFT circuit layer to provide an active pixel area that is at least 80% of the total pixel area with an aperture ratio or fill factor that remains virtually independent of scaling. The design is based on physically-based compact TFT models, which accurately predict both static and dynamic behaviour
Keywords :
amorphous semiconductors <glass and plastic substrs., amorph. Si technol., TFT integrat.>; elemental semiconductors <glass and plastic substrs., amorph. Si technol., TFT integrat.>; silicon <glass and plastic substrs., amorph. Si technol., TFT integrat.>; thin film transistors <glass and plastic substrs., amorph. Si technol., TFT integrat.>; Si:H; active matrix flat panel imager; active matrix organic light emitting diode display; amorphous silicon technology; aperture ratio; circuit topology; fill factor; glass substrate; medical imaging; pixel architecture; plastic substrate; thin film transistor; vertical integration;
fLanguage :
English
Journal_Title :
Circuits, Devices and Systems, IEE Proceedings -
Publisher :
iet
ISSN :
1350-2409
Type :
jour
DOI :
10.1049/ip-cds:20030554
Filename :
1245974
Link To Document :
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