DocumentCode :
829897
Title :
An Accurate C V Measurement Method for Highly Leaky Devices—Part I
Author :
Wang, Y. ; Cheung, Kin Ping ; Choi, R. ; Lee, B.H.
Author_Institution :
Rutgers Univ., Camden, NJ
Volume :
55
Issue :
9
fYear :
2008
Firstpage :
2429
Lastpage :
2436
Abstract :
Accurate C-V measurement becomes extremely difficult in advanced CMOS technology due to a high level of leakage across the gate dielectric. Recently, a new time-domain reflectometry (TDR)-based C-V measurement method was introduced. This new method offers ease of use and high accuracy while being able to handle a very high level of leakage current. It also allows series resistance and overlap capacitance to be extracted simultaneously and accurately without the need for additional measurement. In this paper, the theoretical basis of the TDR C-V method is described in detail, along with experimental results.
Keywords :
CMOS integrated circuits; MOS capacitors; capacitance measurement; leakage currents; semiconductor device measurement; time-domain reflectometry; voltage measurement; TDR C-V measurement method; accurate capacitance-voltage measurement method; advanced CMOS technology; gate dielectric; highly leaky MOS capacitors; highly leaky devices; leakage current; time-domain reflectometry; CMOS technology; Capacitance measurement; Dielectric measurements; Electrical resistance measurement; Integrated circuit measurements; Leakage current; MOS capacitors; Radio frequency; Reflectometry; Time domain analysis; Capacitance–voltage ($C$–$V$); Capacitance–voltage ($C$$V$); RF capacitor; leakage; time domain; time-domain reflectometry (TDR); ultra thin oxide;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2008.928489
Filename :
4595499
Link To Document :
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