Title :
Mechanical stability of a latching MEMS variable optical attenuator
Author :
Syms, Richard R A ; Zou, H. ; Boyle, P.
Author_Institution :
Opt. & Semicond. Devices Group, Imperial Coll., London, UK
fDate :
6/1/2005 12:00:00 AM
Abstract :
The mechanical stability of a latching shutter-insertion variable optical attenuator formed by deep reactive ion etching of bonded silicon-on-insulator (BSOI) is considered. The device can be continuously adjusted or latched into a discrete set of attenuation states using a rack-and-tooth mechanism. Simple numerical and analytic theories are developed to describe the effect of latching. The dynamics of the mechanism are characterized using internal actuation and it is shown that the use of a levered mechanism gives rise to several underdamped, low-frequency in-plane resonances during analog adjustment. Elastic nonlinearity is also identified. Vibration testing is then performed using an external piezoelectric transducer. It is shown that the effect of engaging the latch is to upshift the frequency of the most important mechanical resonance, reducing sensitivity to vibration in fixed attenuation states.
Keywords :
dynamic testing; mechanical stability; micro-optics; micromechanical devices; optical attenuators; silicon-on-insulator; sputter etching; BSOI; MEMS; MOEMS; analytic theories; bonded silicon-on-insulator; deep reactive ion etching; elastic nonlinearity; external piezoelectric transducer; internal actuation; latching shutter-insertion variable optical attenuator; levered mechanism; mechanical stability; microoptoelectromechanical systems; numerical theories; rack-and-tooth mechanism; vibration testing; Bonding; Etching; Micromechanical devices; Optical attenuators; Performance evaluation; Resonance; Silicon on insulator technology; Stability; Testing; Vibrations; Microelectromechanical systems (MEMS); microoptoelectromechanical systems (MOEMS); variable optical attenuator (VOA); vibration testing;
Journal_Title :
Microelectromechanical Systems, Journal of
DOI :
10.1109/JMEMS.2005.844764