• DocumentCode
    832020
  • Title

    A new built-in self-repair approach to VLSI memory yield enhancement by using neural-type circuits

  • Author

    Mazumder, Pinaki ; Jih, Yih-Shyr

  • Author_Institution
    Michigan Univ., Ann Arbor, MI, USA
  • Volume
    12
  • Issue
    1
  • fYear
    1993
  • fDate
    1/1/1993 12:00:00 AM
  • Firstpage
    124
  • Lastpage
    136
  • Abstract
    It is shown how to represent the objective function of the memory repair problem as a neural-network energy function, and how to exploit the neural network´s convergence property for deriving optimal repair solutions. Two algorithms have been developed using a neural network, and their performances are compared with that of the repair most (RM) algorithm. For randomly generated defect patterns, a proposed algorithm with a hill-climbing capability successfully repaired memory arrays in 98% cases, as opposed to RMs 20% cases. It is demonstrated how, by using very small silicon overhead, one can implement this algorithm in hardware within a VLSI chip for built in self repair (BISR) of memory arrays. The proposed auto-repair approach is shown to improve the VLSI chip yield by a significant factor, and it can also improve the life span of the chip by automatically restructuring its memory arrays in the event of sporadic cell failures during the field use
  • Keywords
    VLSI; convergence; integrated memory circuits; neural nets; optimisation; BISR; VLSI chip yield; VLSI memory yield enhancement; auto-repair approach; built-in self-repair; convergence property; hill-climbing capability; memory repair problem; neural-network energy function; neural-type circuits; objective function; optimal repair solutions; randomly generated defect patterns; Built-in self-test; Circuit faults; Content addressable storage; Hip; Neural network hardware; Neural networks; Pulp manufacturing; Software algorithms; Very large scale integration; Virtual manufacturing;
  • fLanguage
    English
  • Journal_Title
    Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0278-0070
  • Type

    jour

  • DOI
    10.1109/43.184849
  • Filename
    184849