• DocumentCode
    832134
  • Title

    The amazing vanishing transistor act

  • Author

    Geppert, L.

  • Volume
    39
  • Issue
    10
  • fYear
    2002
  • fDate
    10/1/2002 12:00:00 AM
  • Firstpage
    28
  • Lastpage
    33
  • Abstract
    Radical changes are in the offing for transistors as their dimensions shrink to a few tens of nanometers. In 10 years time, the gate length-the market for gauging how small the transistor is-will be roughly one-fifth the size of the smallest in production today, only 10 nm instead of today´s 50 nm. To get to that size and ensure that the transistor still operates will require many changes: to improve performance, silicon will be mixed with a semiconductor like germanium to produce a more spacious, strained crystalline structure that lets electric charge carriers move faster; to reduce the leakage of current that drives up power consumption, gate oxides will be made of materials with more than eight times the dielectric constant (k) of today´s silicon dioxide; for better control of the transistor´s on and off states, gates will be of metal, instead of polysilicon; and for better control and (again) to reduce power consumption, gates themselves will be doubled up so that two will do the job a single gate does now. Among these techniques, strained silicon is the only one to have been commercialized so far. The rest are still at various stages of R&D.
  • Keywords
    CMOS integrated circuits; ULSI; VLSI; field effect transistors; integrated circuit design; integrated circuit technology; nanotechnology; 10 nm; FinFET; current leakage reduction; dielectric constant; electric charge carriers velocity improvement; gate oxides; germanium; metal gates; silicon; strained crystalline structure; transistors; Charge carriers; Crystalline materials; Crystallization; Energy consumption; Germanium; Production; Silicon; Size control; Strain control; Transistors;
  • fLanguage
    English
  • Journal_Title
    Spectrum, IEEE
  • Publisher
    ieee
  • ISSN
    0018-9235
  • Type

    jour

  • DOI
    10.1109/MSPEC.2002.1038566
  • Filename
    1038566