Title :
Sensitivity Analysis of Coupled Interconnects for RFIC Applications
Author :
Shi, Xiaomeng ; Yeo, Kiat Seng ; Ma, Jian-Guo ; Do, Manh Anh ; Li, Er-Ping
Author_Institution :
Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore
Abstract :
This paper investigates the sensitivity of on-wafer coupled interconnects to the Si CMOS process parameters. Experiments are conducted to emulate state-of-the-art and future technologies. Some important parameters characterizing the coupled interconnects have been examined. The influence of the process parameters on transmission, reflection, near-end, and far-end crosstalk capacities of the coupled interconnects are discussed
Keywords :
CMOS integrated circuits; integrated circuit interconnections; radiofrequency integrated circuits; sensitivity analysis; CMOS process; RFIC applications; coupled interconnects; on-wafer coupled interconnects; sensitivity analysis; CMOS technology; Couplings; Crosstalk; Integrated circuit interconnections; Integrated circuit technology; Radio frequency; Radiofrequency integrated circuits; Reflection; Sensitivity analysis; Testing; CMOS process; coupled interconnects; sensitivity;
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on
DOI :
10.1109/TEMC.2006.884417
