DocumentCode :
833805
Title :
On-chip actuation of an in-plane compliant bistable micromechanism
Author :
Baker, Michael S. ; Howell, Larry L.
Author_Institution :
Dept. of Mech. Eng., Brigham Young Univ., Provo, UT, USA
Volume :
11
Issue :
5
fYear :
2002
fDate :
10/1/2002 12:00:00 AM
Firstpage :
566
Lastpage :
573
Abstract :
A compliant bistable micromechanism has been developed which can be switched in either direction using on-chip thermal actuation. The energy storage and bistable behavior of the mechanism is achieved through the elastic deflection of compliant segments. The Pseudo-Rigid-Body Model was used for the compliant mechanism design, and for analysis of the large deflection flexible segments. To achieve on-chip actuation, the mechanism design was optimized to allow it to be switched using linear motion thermal actuators. The modeling theory and analysis are presented for three design iterations, with two iterations fabricated in the MUMP´s process and the third in the SUMMiT process.
Keywords :
internal stresses; microactuators; semiconductor device models; semiconductor relays; semiconductor switches; MUMP´s process; SUMMiT process; bistable behavior; elastic deflection; energy storage; in-plane compliant bistable micromechanism; large deflection flexible segments; linear motion thermal actuators; micro relay; micro switch; on-chip thermal actuation; pseudo-rigid-body model; Design optimization; Energy consumption; Energy storage; Hydraulic actuators; Microrelays; Microswitches; Microvalves; Residual stresses; Switches; Thermal force;
fLanguage :
English
Journal_Title :
Microelectromechanical Systems, Journal of
Publisher :
ieee
ISSN :
1057-7157
Type :
jour
DOI :
10.1109/JMEMS.2002.803284
Filename :
1038852
Link To Document :
بازگشت