• DocumentCode
    833872
  • Title

    Single crystal silicon nano-wire piezoresistors for mechanical sensors

  • Author

    Toriyama, Toshiyuki ; Tanimoto, Yasutada ; Sugiyama, Susumu

  • Author_Institution
    New Energy & Ind. Technol. Dev. Organ., Tokyo, Japan
  • Volume
    11
  • Issue
    5
  • fYear
    2002
  • fDate
    10/1/2002 12:00:00 AM
  • Firstpage
    605
  • Lastpage
    611
  • Abstract
    A p-type silicon (Si) nano-wire piezoresistor, whose minimum cross-sectional area is 53 nm×53 nm, was fabricated by combination of thermal diffusion, EB (electron beam) direct writing and RIE (reactive ion etching). The maximum value of longitudinal piezoresistance coefficient πl[011] of the Si nano-wire piezoresistor was found to be 48×10-5 (1/MPa) at surface impurity concentration of 5×1019 (cm-3) and it has enough sensitivity for mechanical sensor applications. The longitudinal piezoresistance coefficient πl[011] of the Si nano-wire piezoresistor increased up to 60% with a decrease in the cross sectional area, while transverse piezoresistance coefficient πt[011] decreased with a increase in the aspect ratio of the cross section. These phenomena were briefly investigated based on a hole energy consideration and FEM (finite element method) stress analysis.
  • Keywords
    diffusion; electron beam lithography; elemental semiconductors; finite element analysis; microsensors; nanotechnology; piezoresistance; piezoresistive devices; silicon; sputter etching; stress analysis; 53 nm; EB direct writing; FEM; RIE; Si; aspect ratio; cross-sectional area; hole energy consideration; longitudinal piezoresistance coefficient; mechanical sensors; nano-wire piezoresistors; p-Si; stress analysis; surface impurity concentration; thermal diffusion; transverse piezoresistance coefficient; Electron beams; Etching; Finite element methods; Impurities; Mechanical sensors; Piezoresistance; Piezoresistive devices; Silicon; Stress; Writing;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2002.802905
  • Filename
    1038857