Title :
Single crystal silicon nano-wire piezoresistors for mechanical sensors
Author :
Toriyama, Toshiyuki ; Tanimoto, Yasutada ; Sugiyama, Susumu
Author_Institution :
New Energy & Ind. Technol. Dev. Organ., Tokyo, Japan
fDate :
10/1/2002 12:00:00 AM
Abstract :
A p-type silicon (Si) nano-wire piezoresistor, whose minimum cross-sectional area is 53 nm×53 nm, was fabricated by combination of thermal diffusion, EB (electron beam) direct writing and RIE (reactive ion etching). The maximum value of longitudinal piezoresistance coefficient πl[011] of the Si nano-wire piezoresistor was found to be 48×10-5 (1/MPa) at surface impurity concentration of 5×1019 (cm-3) and it has enough sensitivity for mechanical sensor applications. The longitudinal piezoresistance coefficient πl[011] of the Si nano-wire piezoresistor increased up to 60% with a decrease in the cross sectional area, while transverse piezoresistance coefficient πt[011] decreased with a increase in the aspect ratio of the cross section. These phenomena were briefly investigated based on a hole energy consideration and FEM (finite element method) stress analysis.
Keywords :
diffusion; electron beam lithography; elemental semiconductors; finite element analysis; microsensors; nanotechnology; piezoresistance; piezoresistive devices; silicon; sputter etching; stress analysis; 53 nm; EB direct writing; FEM; RIE; Si; aspect ratio; cross-sectional area; hole energy consideration; longitudinal piezoresistance coefficient; mechanical sensors; nano-wire piezoresistors; p-Si; stress analysis; surface impurity concentration; thermal diffusion; transverse piezoresistance coefficient; Electron beams; Etching; Finite element methods; Impurities; Mechanical sensors; Piezoresistance; Piezoresistive devices; Silicon; Stress; Writing;
Journal_Title :
Microelectromechanical Systems, Journal of
DOI :
10.1109/JMEMS.2002.802905