Structural testing of the HYPRES niobium process

The HYPRES 3.0 μm niobium (Nb) process has proven to be capable of realizing complex low temperature superconductor (LTS) rapid single flux quantum (RSFQ) circuits. In such a mature fabrication process, the importance of the detection of random defects is crucial as they contribute to the majority of the defects occurring while processing the chips. The global low yield in superconductor electronics (SCE) is due to the fact that little is known about the defects and fault mechanisms occurring in Nb technology. This is, however, of crucial importance in realizing the required complex systems with yields required for commercial production. For this purpose, a structural testing approach has been applied to the HYPRES Nb process. As a result, we have developed test structures for the detection of random defects in the process. Test chips were realized in the process and measurements were carried out. Test results on the processed chips leading to defect statistics in the HYPRES Nb process are presented in this paper.