DocumentCode
833911
Title
A fast turn-around time process for fabrication of qubit circuits
Author
Patel, Vijay ; Chen, Wei ; Pottorf, Shawn ; Lukens, James E.
Author_Institution
Phys. & Astron. Dept., Stony Brook Univ., NY, USA
Volume
15
Issue
2
fYear
2005
fDate
6/1/2005 12:00:00 AM
Firstpage
117
Lastpage
120
Abstract
The authors describe a process for fabrication of Nb/AlOx/Nb Josephson junction circuits for quantum computation. The process involves only one etch step and incorporates electron beam lithography and a self-aligned lift-off of the dielectric resulting in a short turn-around time of 4-5 days. Deep submicron junctions of size down to 0.15 × 0.15 μm2 have been fabricated and tested. Results of junction quality measurements will be presented. In particular, a subgap resistance of ∼1 GΩ measured at ∼0.4 K indicates that the junction´s subgap leakage should not be a limitation for quantum computation.
Keywords
aluminium compounds; electron beam lithography; etching; niobium; quantum computing; superconducting integrated circuits; superconducting junction devices; 4 to 5 days; Josephson junction circuits; Nb trilayer junctions; Nb-AlOx-Nb; deep submicron junctions; electron beam lithography; etch step; fast turn-around time process; quantum computation; qubit circuit fabrication; subgap resistance; Circuits; Dielectric measurements; Electrical resistance measurement; Electron beams; Etching; Fabrication; Josephson junctions; Lithography; Niobium; Quantum computing; 1/f noise; Device fabrication; Josephson junctions; quantum computation; self-aligned; sub-gap resistance; submicron junctions;
fLanguage
English
Journal_Title
Applied Superconductivity, IEEE Transactions on
Publisher
ieee
ISSN
1051-8223
Type
jour
DOI
10.1109/TASC.2005.849708
Filename
1439590
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