• DocumentCode
    833911
  • Title

    A fast turn-around time process for fabrication of qubit circuits

  • Author

    Patel, Vijay ; Chen, Wei ; Pottorf, Shawn ; Lukens, James E.

  • Author_Institution
    Phys. & Astron. Dept., Stony Brook Univ., NY, USA
  • Volume
    15
  • Issue
    2
  • fYear
    2005
  • fDate
    6/1/2005 12:00:00 AM
  • Firstpage
    117
  • Lastpage
    120
  • Abstract
    The authors describe a process for fabrication of Nb/AlOx/Nb Josephson junction circuits for quantum computation. The process involves only one etch step and incorporates electron beam lithography and a self-aligned lift-off of the dielectric resulting in a short turn-around time of 4-5 days. Deep submicron junctions of size down to 0.15 × 0.15 μm2 have been fabricated and tested. Results of junction quality measurements will be presented. In particular, a subgap resistance of ∼1 GΩ measured at ∼0.4 K indicates that the junction´s subgap leakage should not be a limitation for quantum computation.
  • Keywords
    aluminium compounds; electron beam lithography; etching; niobium; quantum computing; superconducting integrated circuits; superconducting junction devices; 4 to 5 days; Josephson junction circuits; Nb trilayer junctions; Nb-AlOx-Nb; deep submicron junctions; electron beam lithography; etch step; fast turn-around time process; quantum computation; qubit circuit fabrication; subgap resistance; Circuits; Dielectric measurements; Electrical resistance measurement; Electron beams; Etching; Fabrication; Josephson junctions; Lithography; Niobium; Quantum computing; 1/f noise; Device fabrication; Josephson junctions; quantum computation; self-aligned; sub-gap resistance; submicron junctions;
  • fLanguage
    English
  • Journal_Title
    Applied Superconductivity, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1051-8223
  • Type

    jour

  • DOI
    10.1109/TASC.2005.849708
  • Filename
    1439590