DocumentCode :
834383
Title :
Area dependence of TDDB characteristics for HfO2 gate dielectrics
Author :
Kim, Young Hee ; Onishi, Katsunori ; Kang, Chang Seok ; Cho, Hag-Ju ; Nieh, Renee ; Gopalan, Sundar ; Choi, Rino ; Han, Jeong ; Krishnan, Siddarth ; Lee, Jack C.
Author_Institution :
Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
Volume :
23
Issue :
10
fYear :
2002
Firstpage :
594
Lastpage :
596
Abstract :
Weibull slopes, area scaling factors, and lifetime projection have been investigated for both soft breakdown and hard breakdown for the first time, in order to gain a better understanding of, the breakdown mechanism of HfO/sub 2/ gate dielectrics. The Weibull slope /spl beta/ of the hard breakdown for both the area dependence and the time-to-dielectric-breakdown distribution was found to be /spl beta/ = 2, whereas that of the soft breakdown was about 1.4. Estimated ten-year lifetime has been projected to be -2 V.
Keywords :
MOS capacitors; Weibull distribution; dielectric thin films; electric breakdown; hafnium compounds; semiconductor device breakdown; semiconductor device reliability; sputtered coatings; 4.8 to 5 nm; HfO/sub 2/ gate dielectrics; HfO/sub 2/-Si; MOS capacitor; TDDB characteristics; Weibull slopes; area dependence; area scaling factors; breakdown mechanism; hard breakdown; lifetime projection; physical thickness; reactive dc magnetron sputtering; reliability; soft breakdown; ten-year lifetime; time-to-dielectric-breakdown distribution; Breakdown voltage; Dielectric breakdown; Dielectric materials; Dielectric measurements; Dielectric substrates; Electric breakdown; Hafnium oxide; Leakage current; MOS devices; Stress;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2002.803751
Filename :
1039178
Link To Document :
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