Title :
An experimental study on transport issues and electrostatics of ultrathin body SOI pMOSFETs
Author :
Ren, Z. ; Hegde, S. ; Doris, B. ; Oldiges, P. ; Kanarsky, T. ; Dokumaci, O. ; Roy, R. ; Leong, M. ; Jones, E.C. ; Wong, H.-S Philip
Author_Institution :
Microelectron. Div., IBM SRDC, Hopewell Junction, NY, USA
Abstract :
We present an experimental study of the transport properties (low field hole mobility μ/sub h/) and electrostatics (threshold voltage V/sub th/, and gate-to-channel capacitance C/sub gc/) of ultrathin body (UTB) SOI pMOSFETs using a large RingFet structure. Body thicknesses were /spl sim/4.3 nm to 50 nm. We find that 1) hole mobility decreases significantly as T/sub Si/<10 nm, and tends to show negligible dependence on the transverse electric field for extremely thin T/sub Si/ (<6 nm) and 2) a V/sub th/ shift of /spl sim/150 mV occurs over the studied T/sub Si/ range, accompanied by enhancement of weak inversion capacitance in thin body devices. Simulations were performed to provide insight into the experimental observations."
Keywords :
MOSFET; capacitance; hole mobility; inversion layers; semiconductor device measurement; silicon-on-insulator; 4.3 to 50 nm; body thicknesses; electrostatics; gate-to-channel capacitance; large RingFet structure; low field hole mobility; simulations; threshold voltage; threshold voltage shift; transport issues; transverse electric field; ultrathin body SOI pMOSFETs; weak inversion capacitance enhancement; Capacitance measurement; Degradation; Electrostatics; Hardware; MOSFET circuits; Quantum mechanics; Scalability; Semiconductor films; Threshold voltage; Wafer bonding;
Journal_Title :
Electron Device Letters, IEEE
DOI :
10.1109/LED.2002.803757