Response surface methodology: a modeling tool for integrated circuit designers

Author

McDonald, James ; Maini, Rajnish ; Spangler, Lou ; Weed, Harrison

Author_Institution

Motorola Inc., Mesa, AZ, USA

Volume

24

Issue

2

fYear

1989

fDate

4/1/1989 12:00:00 AM

Firstpage

469

Lastpage

473

Abstract

An approach to design is described which allows the designer to statistically analyze a circuit´s output characteristics. The results of this analysis give the designer the ability to reduce the sensitivity and to optimize these output characteristics with respect to process, package, and environmental variations. In addition, the authors demonstrate the means by which to establish output specifications before time and money are invested in fabricating devices in silicon. Finally, examples of the successful application of this technique to the design and development of an ECL (emitter-coupled logic) family are discussed. The methods for applying the results from this statistical technique to manufacturing and testing are also shown.<>

Keywords

digital integrated circuits; emitter-coupled logic; integrated circuit technology; integrated logic circuits; logic design; statistical analysis; ECL family design; circuit output characteristics analysis; emitter-coupled logic; integrated circuit designers; manufacturing; modeling tool; output specifications; response surface methodology; sensitivity reduction; statistical technique; testing; Circuit simulation; Equations; Input variables; Integrated circuit modeling; Mathematical model; Packaging; Polynomials; Power supplies; Response surface methodology; Temperature;

fLanguage

English

Journal_Title

Solid-State Circuits, IEEE Journal of

Publisher

ieee

ISSN

0018-9200

Type

jour

DOI

10.1109/4.18611

Filename

18611