DocumentCode :
834583
Title :
Enhanced Flatband Voltage Recovery in Hardened Thin MOS Capacitors
Author :
Boesch, H. Edwin, Jr. ; McLean, F.Barry ; McGarrity, James M. ; Winokur, Peter S.
Volume :
25
Issue :
6
fYear :
1978
Firstpage :
1239
Lastpage :
1245
Abstract :
The short-term recovery of hardened pyrogenic SiO2 MOS capacitors exposed to pulsed electron-beam irradiation was studied as a function of oxide thickness between 200 and 1000 Ã…. Two sets of samples were studied: one set grown to a single thickness and then etched back to various thicknesses, and the other set grown for different lengths of time to varying thicknesses. In both cases, the recovery time was observed to vary approximately as the fourth power of oxide thickness. This anomalous superlinear dependence of recovery time on the SiO2 thickness agrees with the predictions of the stochastic model of hole transport based on a continuous-time random walk. Combining the highly field activated character of hole transport in SiO2 with the thickness dependence reported here demonstrates that very significant gains in the short-term recovery speed can be made by reducing the oxide thickness and/or increasing the oxide field.
Keywords :
Aerospace electronics; Annealing; Capacitance-voltage characteristics; Etching; Insulation; Linear particle accelerator; MOS capacitors; Oxidation; Temperature; Voltage;
fLanguage :
English
Journal_Title :
Nuclear Science, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9499
Type :
jour
DOI :
10.1109/TNS.1978.4329519
Filename :
4329519
Link To Document :
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