Title :
Investigation of the parasitic coupling effects in densely packaged RSFQ digital circuits
Author :
Dimov, B. ; Khabipov, M. ; Balashov, D. ; Brandt, C.M. ; Buchholz, F.-Im. ; Niemeyer, J. ; Ortlepp, Th ; Uhlmann, F.H.
Author_Institution :
Dept. of Fundamentals & Theor. of Electr. Eng., Univ. of Technol. Ilmenau, Germany
fDate :
6/1/2005 12:00:00 AM
Abstract :
The Rapid Single Flux Quantum (RSFQ) technique is regarded as one of the most promising electronics due to its extremely high operating speed and low power consumption. Middle-scale RSFQ applications operating at multigigahertz frequency have recently been reported on. At such high operating frequencies, the on-chip interconnects start to play a limiting role for the performance of the densely packaged digital circuits. Our previous studies have theoretically investigated the parasitic coupling effects between superconductive microstrip transmission lines and conclusions have been drawn about the critical coupling levels of several typical microstrip geometries. Here, basic RSFQ structures are investigated experimentally, which contain a Josephson transmission line stage with large inductance and can either trap or pass SFQ pulses. These structures are incorporated in critical microstrip layouts, thus being subjected to parasitic coupling. The bias levels are monitored at which the structures start to pass the SFQ pulses with and without coupling influences. Thus, the conclusions of our previous theoretical investigations are verified experimentally.
Keywords :
Josephson effect; coupled circuits; digital integrated circuits; integrated circuit interconnections; microstrip circuits; superconducting integrated circuits; superconducting interconnections; superconducting microwave devices; superconducting transmission lines; Josephson transmission line; LTS RSFQ circuits; RSFQ structures; SFQ pulses; bias levels; critical coupling levels; critical microstrip layouts; densely packaged RSFQ digital circuits; high operating frequency; high operating speed; high-density packaging; low power consumption; microstrip geometry; middle-scale RSFQ applications; multigigahertz frequency; on-chip interconnects; parasitic coupling effects; parasitic electromagnetic coupling; rapid single flux quantum technique; superconductive interconnects; superconductive microstrip transmission lines; Coupling circuits; Digital circuits; Distributed parameter circuits; Electronics packaging; Energy consumption; Frequency; Microstrip; Power transmission lines; Superconducting transmission lines; Transmission line theory; High-density packaging; LTS RSFQ circuits; parasitic electromagnetic coupling; superconductive interconnects;
Journal_Title :
Applied Superconductivity, IEEE Transactions on
DOI :
10.1109/TASC.2005.849859