DocumentCode
835247
Title
High performance GaN pin rectifiers grown on free-standing GaN substrates
Author
Limb, J.B. ; Yoo, D. ; Ryou, J.-H. ; Lee, W. ; Shen, S.C. ; Dupuis, R.D.
Author_Institution
Center for Compound Semicond., Georgia Inst. of Technol., Sch. Of Electr. And Comput. Eng., GA
Volume
42
Issue
22
fYear
2006
Firstpage
1313
Lastpage
1314
Abstract
Gallium nitride pin rectifiers grown on bulk GaN substrate have been fabricated and characterised. The device structures were grown by metal organic chemical vapour deposition (MOCVD) on free-standing GaN substrates. The diode structure consisted of an n+-GaN layer, followed by a 2.5 mum unintentionally doped i-GaN layer, and a p-type GaN layer capped with a p++-GaN cap layer. The mesa-structure pin diodes exhibited a blocking voltage as large as Vr~-540 V, and a reverse current density of Ir~0.1 A/cm2 at Vr~-500 V. The forward voltage drop is only 4.4 V at a forward current density of ~100A/cm2, with an on-resistance of 3 mOmega middot cm2 for a circular device with an 80 mum mesa diameter. The breakdown voltage and on-resistance are believed to be the best values reported for vertical mesa GaN pin rectifiers grown on bulk GaN substrates with comparable i-layer thickness
Keywords
III-V semiconductors; MOCVD coatings; gallium compounds; p-i-n diodes; semiconductor device breakdown; solid-state rectifiers; wide band gap semiconductors; GaN; breakdown voltage; current density; mesa-structure pin diodes; metal organic chemical vapour deposition; pin rectifiers;
fLanguage
English
Journal_Title
Electronics Letters
Publisher
iet
ISSN
0013-5194
Type
jour
DOI
10.1049/el:20062261
Filename
4015937
Link To Document