Fabrication and performance of two-dimensional matrix addressable arrays of integrated vertical-cavity lasers and resonant cavity photodetectors

Massively parallel interconnects and scannerless imaging are applications that would benefit from high-density two-dimensional arrays of lasers. Vertical-cavity surface-emitting lasers (VCSELs) are uniquely suited for these applications due to their small size and high efficiency. We have successfully fabricated 64 × 64 element arrays containing alternating rows of selectively-oxidized 850 nm VCSELs and resonant-cavity photodetectors (RCPDs) monolithically integrated on semi-insulating GaAs substrates. In order to reduce the input and output connections to the array, we employ a matrix addressable architecture, where all the VCSELs (or RCPDs) in each row are connected by a common metal trace at the base of their mesas. The columns are connected by metal traces that bridge from mesa top to mesa top, connecting every other row (i.e., only VCSELs or only RCPDs). The pitch of devices in the array is 55 μm, and the total resistance contributed by the long (up to 3.5 mm) row and column traces is below 50 Ω. The design, fabrication, and performance of these arrays are discussed.