DocumentCode :
835661
Title :
The future of semiconductor manufacturing
Author :
Pillai, Devadas
Author_Institution :
Intel Corp., Chandler, AZ
Volume :
13
Issue :
4
fYear :
2006
Firstpage :
16
Lastpage :
24
Abstract :
This paper addresses the evolving requirements for factory integration and automation solutions that are being targeted to address the scale and complexity of the factories of the future. These requirements drive the need for real breakthrough solutions. More than ever before, there must be a strong focus on developing integrated solutions, using mainstream computer communications standards and protocols, so that development and implementation time is minimized and the software solutions are extendible as information technology evolves over time. The volume of manufacturing, process, yield, inspection, quality, and other critical data continues to exponentially increase with each new technology; therefore, its collection, storage, access, sharing, analysis, and retention methods have become a major challenge as well as a strategic competitive advantage for each company. Developing a flexible information systems architecture, with security features taking center stage to thwart possible virus infections, has also become an absolute necessity. Reduction of factory cycle times has become an important priority, as increased inventory (due to larger wafers) of the \´\´wrong" products in an everchanging marketplace results in a high risk of product obsolescence and loss of revenue. Other equally important business drivers facing the new generation of fabs also will be covered in this article
Keywords :
flexible manufacturing systems; information systems; integrated circuit manufacture; production engineering computing; factory cycle times; factory integration; flexible information systems architecture; information technology; semiconductor manufacturing; Access protocols; Communication standards; Data security; Information systems; Information technology; Inspection; Manufacturing automation; Manufacturing processes; Production facilities; Semiconductor device manufacture;
fLanguage :
English
Journal_Title :
Robotics & Automation Magazine, IEEE
Publisher :
ieee
ISSN :
1070-9932
Type :
jour
DOI :
10.1109/MRA.2006.250560
Filename :
4015990
Link To Document :
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