DocumentCode
83621
Title
Fabrication of superhydrophobic surfaces on copper substrates via flow plating technology
Author
Jing Sun ; Long Wang ; Ke Hu ; Jinlong Song ; Xin Liu
Author_Institution
Key Lab. for Precision & Non-traditional Machining Technol. of the Minist. of Educ., Dalian Univ. of Technol., Dalian, China
Volume
10
Issue
2
fYear
2015
fDate
2 2015
Firstpage
88
Lastpage
92
Abstract
The preparation of superhydrophobic surfaces on hydrophilic metal substrates depends on both surface microstructures and low surface energy. Composite electro-brush flow plating technology was developed to prepare appropriate microstructures leading to superhydrophilicity on copper surfaces. The effects of plating voltage and plating time on the coating surface structures and hydrophobicity were discussed. The surface morphology and chemical composition were characterised by scanning electron microscopy and energy-dispersive X-ray spectroscopy. The results demonstrate that the prepared surfaces have the appearance of micro-nano hierarchical structures composed of submicron papilla-like Ni structures and nanoscale Al2O3 particles. After fluoridation, the coating surfaces prepared by proper parameters show superhydrophobicity with a water contact angle of 162° and a sliding angle of less than 10°. Tests of micro hardness, wear resistance and persistence show that the obtained superhydrophobic n-Al2O3/Ni coating surfaces have outstanding mechanical properties and stability. This sample preparation technique has prospective application in the large-scale and continuous production of superhydrophobic engineering materials.
Keywords
X-ray chemical analysis; aluminium compounds; coatings; contact angle; hydrophilicity; hydrophobicity; microfabrication; microhardness; nanofabrication; nanoparticles; nickel; scanning electron microscopy; surface morphology; wear resistance; Al2O3-Ni; Cu; chemical composition; coating surface structures; composite electrobrush flow plating technology; energy-dispersive X-ray spectroscopy; flow plating technology; fluoridation; hydrophilic copper metal substrates; low surface energy; mechanical property; mechanical stability; microhardness testing; microhierarchical structures; nanohierarchical structures; nanoscale particles; plating time effects; plating voltage effects; scanning electron microscopy; sliding angle; submicron papilla-like Ni structure; superhydrophilicity; superhydrophobic coating surfaces; superhydrophobic engineering materials; superhydrophobic surface fabrication; surface microstructures; surface morphology; water contact angle; wear persistence; wear resistance;
fLanguage
English
Journal_Title
Micro & Nano Letters, IET
Publisher
iet
ISSN
1750-0443
Type
jour
DOI
10.1049/mnl.2014.0440
Filename
7051355
Link To Document