DocumentCode :
83637
Title :
Effects of RESET Current Overshoot and Resistance State on Reliability of RRAM
Author :
Jeonghwan Song ; Daeseok Lee ; Jiyong Woo ; Yunmo Koo ; Euijun Cha ; Sangheon Lee ; Jaesung Park ; Kibong Moon ; Misha, Saiful Haque ; Prakash, Aravind ; Hyunsang Hwang
Author_Institution :
Dept. of Mater. Sci. & Eng., Pohang Univ. of Sci. & Technol., Pohang, South Korea
Volume :
35
Issue :
6
fYear :
2014
fDate :
Jun-14
Firstpage :
636
Lastpage :
638
Abstract :
Current overshoot has severe effects on the reliability of resistive random access memory (RRAM). It is well known that the current overshoot during the SET process is caused by parasitic capacitance. In this letter, we observed a different type of current overshoot during the RESET process. The RESET current overshoot was confirmed to have severe effects on the endurance of RRAM. We also demonstrated the relation between the current overshoot and the intrinsic capacitive elements of each state of RRAM. Finally, an optimized pulse shape was proposed to minimize the current overshoot and was experimentally verified to significantly improve the variability and endurance in a typical RRAM device with a W/Zr/HfO2/TiN structure.
Keywords :
hafnium compounds; integrated circuit reliability; random-access storage; titanium compounds; tungsten; zirconium; RESET current overshoot; RRAM reliability; W-Zr-HfO2-TiN; endurance improvement; intrinsic capacitive elements; optimized pulse shape; parasitic capacitance; resistance state; resistive random access memory; variability improvement; Capacitance; Hafnium compounds; Reliability; Resistance; Shape; Switches; Transient response; RRAM; current overshoot; endurance; endurance.; optimized pulse shape; variability;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2014.2316544
Filename :
6800048
Link To Document :
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