DocumentCode
836906
Title
Design, fabrication, and test results of undulators using Nb3Sn superconductor
Author
Prestemon, S.O. ; Dietderich, D.R. ; Bartlett, S.E. ; Coleman, M. ; Gourlay, S.A. ; Lietzke, A.F. ; Marks, S. ; Mattafirri, S. ; Scanlan, R.M. ; Schlueter, R.D. ; Wahrer, B. ; Wang, B.
Volume
15
Issue
2
fYear
2005
fDate
6/1/2005 12:00:00 AM
Firstpage
1236
Lastpage
1239
Abstract
An R&D effort is underway at Lawrence Berkeley National Laboratory (LBNL) to develop the technology of Nb3Sn superconducting undulators (SCUs). Issues relating to the selection of the appropriate conductor are discussed. The design and fabrication of SCUs using Nb3Sn is presented. Two prototype devices have been designed and fabricated at LBNL. The first device concentrated on basic fabrication issues and on magnet protection, a key concern due to extremely high copper current densities during a quench. Test on the first prototype demonstrated that such devices can be passively protected in a scalable manner. The second device incorporated design improvements as well as trim coils that are designed to serve as the basic element of a future active phase error correction approach. Preliminary tests on the second device are presented. The trim coils were successfully tested at a variety of field levels. Two quench runs were performed, both occurring at ∼70% of short-sample Jc. Stability issues associated with flux-jumps and possible epoxy cracking are discussed.
Keywords
machine testing; niobium alloys; stability; superconducting magnets; tin alloys; wigglers; Lawrence Berkeley National Laboratory; Nb3Sn; active phase error correction; design improvements; epoxy cracking; fabrication issues; flux jumps; high copper current densities; magnet protection; stability issues; superconducting undulators; trim coils; Coils; Fabrication; Niobium; Protection; Prototypes; Research and development; Superconducting magnets; Testing; Tin; Undulators; stability; superconducting undulator;
fLanguage
English
Journal_Title
Applied Superconductivity, IEEE Transactions on
Publisher
ieee
ISSN
1051-8223
Type
jour
DOI
10.1109/TASC.2005.849540
Filename
1439865
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