Modeling of multiconductor systems for packaging and interconnecting high-speed digital IC´s

In the design of high-speed circuits, it is important to consider the adverse effects of packaging and interconnections on signal integrity. A review of quasi-TEM capacitance and inductance analysis of multiconductor transmission line systems is presented. The development of three general modeling techniques is discussed, namely, the boundary element method, the finite element method, and the partial element equivalent circuit technique. The application of each method to practical systems is outlined, with particular reference to the literature. A complete formulation for the boundary element, which is applicable to multiconductor systems of arbitrary geometry in nonhomogeneous media, is provided. The analysis of a seven-line buried microstrip structure illustrates the main differences between the finite element and boundary element approaches