DocumentCode :
837787
Title :
I-MOS Transistor With an Elevated Silicon–Germanium Impact-Ionization Region for Bandgap Engineering
Author :
Toh, Eng-Huat ; Wang, Grace Huiqi ; Chan, Lap ; Lo, Guo-Qiang ; Samudra, Ganesh ; Yeo, Yee-Chia
Author_Institution :
Dept. of Electr. & Comput. Eng., Nat. Univ. of Singapore
Volume :
27
Issue :
12
fYear :
2006
Firstpage :
975
Lastpage :
977
Abstract :
An impact-ionization MOS (I-MOS) transistor with an elevated impact-ionization region (I-region) and excellent subthreshold swing of 3.2 mV/dec at room temperature is demonstrated. An elevated Si0.75 Ge0.25 region is integrated and employed to engineer the bandgap and impact-ionization rate in the I-region. Compared to a device with a Si I-region, an I-MOS device with a Si0.75Ge 0.25 I-region shows significantly enhanced performance due to the smaller bandgap of the I-region and the enhanced impact-ionization rate. For the I-MOS device with a Si0.75Ge0.25 I-region, the breakdown voltage is also reduced, and a significant drive current enhancement is achieved at VG-VT=1 V and a gate length of 80 nm
Keywords :
Ge-Si alloys; MOSFET; energy gap; impact ionisation; semiconductor device breakdown; 80 nm; I-MOS transistor; Si0.75Ge0.25; bandgap engineering; breakdown voltage; elevated impact-ionization region; subthreshold swing; CMOS integrated circuits; Implants; Ionization; MOSFETs; Photonic band gap; Power supplies; Reliability engineering; Subthreshold current; Temperature; Threshold voltage; Impact ionization; impact-ionization MOS (I-MOS); silicon–germanium; subthreshold swing;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2006.886708
Filename :
4016205
Link To Document :
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