Title :
Analysis of Phosphorus Flame Retardant Induced Leakage Currents in IC Packages Using SQUID Microscopy
Author :
Deng, Yuliang ; Pecht, Michael ; Rogers, Keith
Author_Institution :
Dept. of Mech. Eng., Maryland Univ., College Park, MD
Abstract :
A superconducting quantum interference device (SQUID) was used to assess leakage currents between adjacent leads of an encapsulated semiconductor device. An electrically conductive path was observed in the package interior. Red phosphorus, used as flame retardant in the mold compound, was identified as the cause of the leakage current path. This paper discusses the principle of SQUID, how it was used to verify and locate the sites of the failure, and the root cause of this new leakage current failure mechanism
Keywords :
SQUID magnetometers; encapsulation; failure analysis; flame retardants; integrated circuit packaging; leakage currents; SQUID microscopy; encapsulated semiconductor device; failure mechanism; flame retardant; green mold compound; integrated circuit packages; leakage currents; red phosphorus; superconducting quantum interference device; Flame retardants; Integrated circuit packaging; Interference; Lead compounds; Leakage current; Microscopy; SQUIDs; Semiconductor device packaging; Superconducting devices; Superconducting integrated circuits; Flame retardant; green mold compound; red phosphorus; superconducting quantum interference device (SQUID);
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/TCAPT.2006.885960
