Title :
Optimization of Thermomechanical Reliability of Board-level Package-on-Package Stacking Assembly
Author :
Lai, Yi-Shao ; Wang, Tong Hong ; Wang, Ching-Chun
Author_Institution :
Adv. Semicond. Eng. Inc, Kaohsiung
Abstract :
In this paper, the Taguchi optimization method is applied to obtain the optimal and robust design towards enhancement of board-level thermomechanical reliability of a package-on-package stacking assembly under an accelerated thermal cycling test condition. An L18(2 1times37) orthogonal array is arranged for the optimization of eight selected control factors of the assembly, including thickness of dies, molding compounds, and substrates, sizes of package and molding compound, and solder joint standoffs. The importance of each of these control factors is compared and ranked
Keywords :
Taguchi methods; ball grid arrays; integrated circuit reliability; system-in-package; Taguchi optimization; accelerated thermal cycling test; board-level reliability; optimal design; package-on-package stacking assembly; robust design; thermomechanical reliability; Assembly; Life estimation; Optimization methods; Packaging; Robustness; Size control; Stacking; Testing; Thermomechanical processes; Thickness control; Board-level reliability; Taguchi; optimization; package-on-package (PoP); thermal cycling;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/TCAPT.2006.885970
